Samsung’s upcoming 2015 flagship, the Galaxy S6, could prove as the thinnest and lightest smartphone on release date thanks mostly to a new memory technology that the company dubbed as the one-package ePoP, which as of this week is already in the mass production stage.
In a statement posted on its official blog site Samsung Tomorrow, Samsung Electronics officially introduced “our new high-density ePoP memory for flagship smartphones.” The company added that ePoP memory package was initially designed for wearable devices like a smartwatch but is also reconfigurable for high-end tablets.
With the revelation that the breakthrough memory module is all set for bulk manufacture, it can be assumed that the same technology will officially debut with the Galaxy S6, BGR said in a report. The high-density ePoP also best explains why the Galaxy S5 replacement promises to boast of the slimmest and lightest smartphone profile once it comes out of the box.
Design efficiency
In using the ePoP set up, the Galaxy S6 stands to gain 40 per cent more of internal device area as the module crams the RAM and internal flash memory, including the controller, into a single package. Samsung explained that ePoP will do away with the previous configuration – setting the RAM and memory device side by side that eats up precious space.
The ePoP module is also designed to be placed on top of the application processor, thereby giving more space for other device components.
One clear benefit that the technology will bring in is to allow smartphone vendors to use relatively bigger and higher-capacity battery while keeping the device footprint at the minimum, BGR said, thus proving more operating hours to smartphone users despite the thin and light built.
The new memory configuration will only require a total board area of 225 square millimetres, compared to the old PoP model that takes up as much as 374.5 square millimetres, Samsung said.
Technical benefits
The Samsung Galaxy S6 is also visualised to gain considerable technical benefits from ePoP as Samsung declared that its innovation will surely satisfy “the market needs for high speed, high energy efficiency and compactness.”
Embedded with ePoP is a 3GB LPDDR3 RAM that has a 64-bit I/O bandwidth and a 32GB eMMC. Both are hardwired to work with the 64-bit mobile computing architecture that is expected as the standard with the Galaxy S6.
Per BGR, the high-density ePoP memory is likely one of the secret weapons packed by Samsung with the Galaxy S6 release date, which could come a month after the device’s scheduled March 1 intro or a day before the MWC 2015 kick off.
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